Thermal glue for heat flux sensor

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Thermal glue for heat flux sensor

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Article Number:

A-018884

Product:

gSKIN® MOUNT-1213

Product Type:

Thermal Glue

Operating Temperature Range Min/Max [°C]:

-40 / 150

Dimensions / Quantity:

1 x 1g; 1 x 4g

Thermal Conductivity [W/(mK)]:

0.9

Product Specifications:

Thermally conductive and electrically insulating two component glue

Surface Curing (25°C):

2 hours

Total Curing (25°C):

5 - 7 Days

Black:Yellow Compound Mixture Ratio:

4:1

Black Compound Constituents::

4g

Epoxy Resin:

22%

Aluminium Nitride:

70-73%

Epoxy Diluent:

4-6%

Substituted Silane:

0.1 - 0-2%

Carbon Black:

0.5 - 1%

Yellow Compound Constituents::

1g

Polyamide:

80-100%

Additive:

0 - 5%